解黏膠膜Thermal Release Tape
產品介紹
UV解黏膠膜 UV Tape
用途:應用於玻璃裁切保護、拋光、研磨、顯影、矽晶片、陶瓷機板 ...UV-2 雙面UV解黏膠帶 UV Tape
用途:應用於玻璃裁切保護、拋光、研磨、顯影、矽晶片、陶瓷機板 ...HR-160 熱解黏膠帶 Heat Release Tape
用途:160℃解黏膠膜應用於銅箔基版、研磨、顯影、矽晶片、陶 ...HR180-2 雙面180℃解膠膜 Heat Release Tape
用途:晶片及積層陶瓷電容之堆疊、切割、研磨、翻轉(MLCC),尤其 ...HR-180 單面180℃解膠膜 Heat Release Tape
用途:晶片及積層陶瓷電容之堆疊、切割、研磨、翻轉(MLCC),尤其 ...HR150-2 雙面150℃解膠膜 Heat Release Tape
用途:晶片及積層陶瓷電容之堆疊、切割、研磨、翻轉(MLCC),尤其 ...HR-150 單面150℃解膠膜 Heat Release Tape
用途:晶片及積層陶瓷電容之堆疊、切割、研磨、翻轉(MLCC),尤其 ...HR120-2 雙面120℃解膠膜 Heat Release Tape
用途:晶片及積層陶瓷電容之堆疊、切割、研磨、翻轉(MLCC),尤其 ...HR-120 單面120℃解膠膜 Heat Release Tape
用途:晶片及積層陶瓷電容之堆疊、切割、研磨、翻轉(MLCC),尤其 ...